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Thin films · Vertical device integration

Vertical integration of selector and RRAM layers

Experimental development of vertically integrated selector–memory structures, with current work on interface quality and temperature-controlled electrical testing.

Wang’s Thin Film Group · Purdue UniversityOngoing experimental research

Integrating a selector with resistive memory

This experimental project investigates vertically integrated one-selector/one-resistor (1S1R) structures. The goal is to understand how the physical interfaces in a multilayer device affect its electrical behavior and the compatibility of the selector and memory functions.

The project is distinct from my compact-model and programming work: here the main focus is materials and device integration. Achieving a multilayer structure and demonstrating the intended selector behavior are separate experimental milestones.

Cross-sectional microscopy of an experimental multilayer stack with a 20 nanometer scale bar
Cross-sectional microscopy from the integration project (20 nm scale bar). The image provides structural evidence of the multilayer specimen and a view of its interfaces. It does not establish electrical selector performance.

My contribution

I worked on thin-film fabrication and structural and electrical characterization, connecting observations about interfaces to questions about device behavior.

  • Fabrication and iteration: developing multilayer specimens and investigating the quality of their interfaces.
  • Electrical characterization: evaluating switching behavior and whether the response is consistent with the intended device function.
  • Structure–property analysis: using microscopy and other materials-characterization tools to interpret the experimental behavior.

The central question is whether structural quality and electrical function improve together. A clear interface in microscopy is useful evidence, but electrical testing is still required to distinguish selector operation from memory-like switching.

Current stage & next questions

The project remains under experimental development. As of September 2026, my focus is interface-quality optimization and temperature-controlled electrical testing.

Question Relevant evidence Current scope
Are the layers and interfaces well formed? Cross-sectional microscopy and materials characterization Structural characterization is part of the existing project record
Does the device exhibit the intended electrical function? Electrical switching and repeatability checks Evaluation remains ongoing
How does the response depend on temperature? Temperature-controlled electrical tests Current work; no completed temperature-dependent result reported here

This distinction between structure, function, and temperature dependence guides the research questions without treating an intermediate specimen as a completed 1S1R device.

Research context

Research background in my CV (PDF)

Explore the related compact-model and programming project